The Chip Scale Package introduced in the early 90s is essentially a smaller version of the BGA and represents the continuing trend in package miniaturization. Industry arbitrarily defines a CSP as any ...

And we heartily endorse that. The chip is an ATtiny20 in a WLCSP (wafer-level chip-scale package) that’s a mere 1.5 mm by 1.4 mm. The underside of the chip has twelve tiny solder balls in a ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

The recent trend toward portable systems is driving the single chip packages into area array packages such as ball grid array (BGA) or chip scale package (CSP). This chapter is about all single chip ...

In a paper in the journal Scientific Reports, Blumenthal, Isichenko and team present a development in this direction with a chip-scale ultra-low-linewidth self-injection locked 780 nm laser.

The move marks one of the Biden Administration’s last large scale effort ... The package includes curbs on China-bound shipments of high bandwidth memory (HBM) chips, which are critical for ...