That compact size is thanks to GaN semiconductors, which are able to run cooler at higher power levels than their silicon forebearers. Cracking into the charger required levering open the case.

In present GaN-on-Diamond devices a thin dielectric layer is required on the GaN surface to ... Reduced requirements for cooling/increased reliability will result in major cost savings at the system ...

GaN typically has higher energy efficiency in all power conversion and RF applications compared to silicon, which also leads to a greener solution at the systems level, he added. Its use cases ...