Hosted on MSN1mon
Intel Demonstrates Industry-First Advancements in Transistor and Packaging Technologies at IEDM 2024Intel Foundry showcased new material ... high electron mobility transistors), fabricated on a 300 mm GaN-on-TRSOI (“trap-rich” silicon-on-insulator) substrate. Advanced-engineered substrates ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback