tom's Hardware on MSN17h
Blackwell GPU reportedly takes 3X to 4X longer to test than Hopper — more complex designs lead to skyrocketing test requirementsTest protocols must cover high-speed interconnects, stress conditions, thermal conditions (which, in the case of the B200, ...
For example, there is more than one way to move data across a fixed distance. In some cases, this could involve a pre-built, ...
Ayar Labs Inc., a startup that’s developing optical interconnects that can transmit data between computer chips via light, said today it has closed on a hefty late-stage $155 million funding round led ...
Synopsys has announced Ultra Ethernet and UALink IP solutions to meet the demand for high-bandwidth and low-latency HPC and ...
Ayar Labs, the Silicon Valley startup at the forefront of high-speed optical interconnect development, says it has raised ...
As the demand for AI and machine learning accelerates, the need for faster and more flexible data interconnects has never ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technology ...
The LPO chipset expands the industry-leading interconnect portfolio from Marvell, which includes PAM4 optical DSPs, coherent DSPs, data center interconnects, Alaska® A active electrical cable ...
Semiconductor packaging underfill reduces the impact of the global thermal expansion mismatch between the substrate and ...
Destination 2D, a Milpitas startup which has graphene inventor and Nobel laureate Konstantin Novoselov (pictured) as its chief scientist, has made ...
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