As reported in the latest issue of Nature Communications, the new platform—dubbed “charge programmed multi-material 3D ...

Partners drive cutting-edge WLAN testing to deliver a real-world environment that is integral to the development of ...

The VITA trade group has several working groups for the VITA 100 next generation high performance OpenVPX embedded computing ...

As expected, the White House of outgoing President Biden has announced an Interim Final Rule (IFR) on the sale of AI chips ...

Researchers at Stanford Engineering have developed an ultrathin material that conducts electricity better than copper and ...

Intel has started to sample Panther Lake, its next generation mobile x86 processor implemented on the 18A manufacturing ...

have identified and eliminated a previously unknown loss mechanism in organic solar cells that makes them more efficient and ...

The UK government has launched a plan for AI data centres that its says has the backing of £14bn (€16.7bn, $17bn) of ...

The European Innovation Council (EIC) has detailed the emerging technology trends it sees as important for the region in the ...

Desay SV is using the Snapdragon Cockpit Elite chipset from Qualcomm Technologies for its latest AI-enabled cabin platform.

Vertical Compute has raised €20m to commercialise MRAM in-memory computing chiplet technology developed at imec in Belgium.

Japanese foundry Rapidus Inc. is planning to supply a 2nm prototype IC to US fabless chip company Broadcom in June, according to Nikkei.