Ricoh Company has developed a process to join aluminium parts fabricated by Binder Jetting (BJT) to wrought aluminium alloy.

Researchers from the City University of Hong Kong (CityUHK) have achieved a significant breakthrough in electronic packaging ...

As a result of analysis of the bonding interface using TEM, the 5 nm Au sample showed more Au-Cu diffusion than the 12 nm Au sample, showing a bond close to a pure Cu-Cu bonding interface.

building capabilities in advanced and complex manufacturing technologies like EBW and diffusion bonding. Currently, shunts and bimetals contribute to around 45 per cent each to the topline ...

Flurry of regulation and fundings in U.S.; Chinese blacklist expands; materials report; new 3D interconnect process control; ...

All the operations below can be performed at an object level. Our framework is general and can be applied to any diffusion model.

Chemical bonding refers to the attraction between atoms and can come in several different types with varying strength. It allows the formation of substances with more than one atomic component and ...

A model showing how metallic bonds are formed - the first diagram shows the outer electrons in their atoms, and the second diagram shows that the electrons have become delocalised ...

Thanks to @zjysteven for his efforts. Below shows an example with stable-diffusion-2-1-base. import torch from PIL import Image, ImageDraw from copy import deepcopy ...

CES 2025 kicks off this week in Las Vegas — where swaths of the latest gadgets and advances across industries like personal tech, transportation, health care, sustainability and more are set to be on ...