Large area graphene synthesis typically involves chemical vapour deposition (CVD) which requires high temperatures that far exceed the allowed thermal budget of CMOS interconnect fabrication, and also ...

Arizona-based Hyperion Technologies Inc. wants to fill a gap in the nation’s emerging semiconductor ecosystem. The fledgling company has proposed a leading-edge, fully automated manufacturing ...

“Connecting chiplets to chiplets is really not that much different than connecting components together on a printed circuit board or die on an organic substrate,” said Brad Griffin ... which is the ...

This year, groundbreaking NoC soft tiling capabilities were introduced within Arteris’ FlexNoC and Ncore interconnect IPs. This transformative approach enables SoC architects to partition chips into ...

AMD has been granted a patent (12080632) that covers glass core substrate tech ... can improve lithography focus for ultra-dense interconnects in advanced system-in-packages, whereas superior ...

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