Due to the downturn in the NAND flash industry, South Korean memory manufacturers Samsung Electronics (Samsung) and SK Hynix are implementing an investment strategy focused on cost... According to ...
Abstract: For high-power modules with wire bonding as the interconnection method, fatigue damage and cracking at the bond interface are important forms of module failure. However, the currently used ...
The company’s memory roadmap, as outlined in the report, shows plans for an advanced 10th-generation NAND that will utilize bonding technology to separately build memory cells and the peripheral ...
NANDFCTRL2 is a VHDL IP core implementing an interface to NAND flash memory devices. The core supports ONFI 4.0 and provides DMA transfers to and from the memory. The core implements a BCH EDAC ...
Samsung is reportedly working on a 400-layer NAND flash chip, which it plans to release by 2026. The company’s roadmap includes developing bonding vertical NAND (BV NAND) technology, which will ...
From Japan to the world, Kaijo continues to strive for excellence with their highly appraised wire bonding and cleaning services that cater to a wide portfolio of industries.
Micron Technology (NASDAQ:MU) suffered from a greater-than-expected revenue decline in NAND flash memory when it reported its first quarter fiscal 2025 results on Wednesday, leading to a rating ...
Abstract: Monitoring bond wire lift-off unevenness is the basis for high reliability operation of multichip silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) power ...
The joint venture will enable MiPhi to develop high-end and customized NAND storage products for enterprise ... a joint venture (Graphic: Business Wire) As India emerges as a global economic ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Micromax Informatics, India’s home-grown consumer electronics brand and Phison, a leading innovator in NAND controller and NAND storage technologies ...