Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=55 ...

Electronics designers are moving away from conventional Si-based power electronics and towards wide-bandgap solutions.

Chinese module maker GCL SI has expanded into back contact (BCI solar cell production with its first 660 W BC module, ...

Abstract: Recently, all-group-IV (Si)GeSn alloys attracted great attention as materials for Infra-Red optoelectronics monolithically integrated on Si substrates. In this work, we present the ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

Substrates or subfloors are the surfaces on which floorcovering materials are applied. They can be wood, concrete, plywood, stone or metal. Regardless of the material, there are specific ...

Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed novel OLED stacks that enable ...

Department of Chemistry and Materials Engineering, Faculty of Chemistry, Materials and Bioengineering, Kansai University, Suita, Osaka 564-8680, Japan ...

College of Pharmaceutical Sciences, Zhejiang University, Hangzhou 310058, Zhejiang, China ...

Imec, the research and innovation hub, has announced a significant milestone in silicon photonics. The organisation has been ...