Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

Let's rewind to 2013 and the A7, Apple's first 64-bit chip built on TSMC's 28nm process. At the time, those 28nm wafers cost ...

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where a polysilicon ingot is cut into individual wafers. NexWafe CEO, Davor Sutija, told PV Tech: “When you don’t saw, you don’t have to do saw damage etch removal in the cell [production ...

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wafers, while offering the potential for significant cost savings by reducing material losses, energy consumption by 40%, and eliminating the saw damage etching process step in cell production ...

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Due to the SiC boule’s extreme hardness, it is sliced into wafers, usually with diamond-encrusted wire saws. The wafers are then ground flat and polished, and the substrate surface is treated to ...