Director Haneef Adeni's Marco is a high-octane action thriller about a man who goes to any lengths for his family. The action choreography is brilliant in this wafer-thin story.
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.
where a polysilicon ingot is cut into individual wafers. NexWafe CEO, Davor Sutija, told PV Tech: “When you don’t saw, you don’t have to do saw damage etch removal in the cell [production ...
wafers, while offering the potential for significant cost savings by reducing material losses, energy consumption by 40%, and eliminating the saw damage etching process step in cell production ...
A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...
The wafers are a crucial component of advanced semiconductors ... told reporters in Taiwan on a conference call that the company saw localization as having its advantages at a time when the ...