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AMD 将在 "Strix Halo" Ryzen AI Max 处理器中采用全新 CCD 连接
AMD 最新的笔记本电脑 Ryzen AI 处理器(代号为 "Strix Halo")在其芯片组之间采用了并行的 "线海(sea of wires)"互连系统,取代了台式机 Ryzen 型号中的 SERDES(串行器/解串器)方法。该处理器的物理实现由两个核心复合芯片(CCD)组成,每个芯片都采用台积电的 N4(4 纳米)工艺制造,包含多达八个 Zen 5 内核和完整的 512 位浮点运算单元。
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Rubin Observatory aces 1st image tests, gets ready to use world's largest digital camera
That camera, called LSSTCam (the telescope was originally called the Large Scale Synoptic Telescope), has 21 times the field ...
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