The Chip Scale Package introduced in the early 90s is essentially a smaller version of the BGA and represents the continuing trend in package miniaturization. Industry arbitrarily defines a CSP as any ...

And we heartily endorse that. The chip is an ATtiny20 in a WLCSP (wafer-level chip-scale package) that’s a mere 1.5 mm by 1.4 mm. The underside of the chip has twelve tiny solder balls in a ...

The recent trend toward portable systems is driving the single chip packages into area array packages such as ball grid array (BGA) or chip scale package (CSP). This chapter is about all single chip ...

Surfaces beneath flip chips, chip-scale packages, and ball grid arrays can be activated to improve fillet height, wicking speed, and interface adhesion. Hybrid bonding is transforming semiconductor ...