The Information notes that Blackwell GB200 racks, crucial components in data centers, have exhibited problems during initial ...

“It looks like semiconductor production equipment has legs here.” Japanese chip package substrate maker Ibiden Co., which ...

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Nvidia is set to keep its dominance in the AI chip market with an estimated 80% to 85% market share in the next 12 to 18 ...

Some possible package types include: Advanced flip-chip packages 3D-stacked die packages Wafer-level chip-scale packages Interposer-based packages These packages are placed into the same assembly as ...

The hardware choices for AI inference engines are chips, chiplets, and IP. Multiple considerations must be weighed.

Surfaces beneath flip chips, chip-scale packages, and ball grid arrays can be activated to improve fillet height, wicking speed, and interface adhesion. Hybrid bonding is transforming ...

Intel introduces new chip lineup for creators and gamers at CES 2025, featuring improved AI performance and efficiency.

Richmond-based Keya Snacks this week is unveiling a new Black Salt variety of its bagged chips as well as the introduction of ...

ECE Prof. Daniel Blumenthal, GSR Andrei Isichenko, and OCAQπ Group research highlighted in The UCSB Current article “Bringing the Power of Tabletop Precision Lasers for Quantum Science to the Chip ...

Abstract: Throughout the past four decades, semiconductor technology has advanced at exponential rates in both productivity and performance. In recent years, multilevel interconnect networks have ...

Kyocera AVX has expanded its CR series of high-power chip resistors with a device that handles 2.5 W in a small 0603 package. Designed to enable the miniaturization of RF power amplifiers, the 0603 ...