3711.TW ASE Technology Holding Co., Ltd.

The result: distortion in the X/Y plane that impacts the topography of the substrate surface, hindering its use at finer nodes. In addition, the electroless copper seed metal used in the RDL plating ...

This year, groundbreaking NoC soft tiling capabilities were introduced within Arteris’ FlexNoC and Ncore interconnect IPs. This transformative approach enables SoC architects to partition chips into ...

Kaynes Technology India Limited (KTIL) proposal for setting up of Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat for Wire bond Interconnect, Substrate Based Packages ...

The production capacity would be around 15.07 million units per day. Kaynes Technology India Limited (KTIL) proposal for setting up of Outsourced Semiconductor Assembly and Test (OSAT) facility at ...