The Fraunhofer Institute for Reliability and Microintegration IZM announces its active contribution to the APECS pilot line launched as part of the EU Chips Acts. APECS intends to promote the ...

Infineon Technologies say sit has developed the first single chip CMUT capacitive MEMS ultrasonic transducer for switches and medical designs ...

Researchers in China have investigated the impact of phosphorus diffusion gettering on industrial silicon heterojunction ...

The next-generation UCIe physical layer IP, based on TSMC's N4 process, is expected to finalize its design later this year, ...

Chinese silicon carbide (SiC) substrate manufacturers are facing mounting pressures as quality issues and a looming US trade ...

The Zoning Board of Appeals has scheduled a continued public hearing on a special permit for a proposed 4.9-acre gravel pit ...

Imec, a research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically driven ...

Rad-hard devices are expensive to produce due to the raw materials used and special shielded packaging on the electronic ...

Roads are slowly killing themselves, self-destructing because of a hard-to-stop chemical reaction caused by the rock used in ...

Test Research, Inc. has launched the 3D AXI TR7600FB SII system, designed to deliver clearer imaging. The new X-ray imaging ...

Collectively, that makes screening for process defects in interposer interconnects and micro-bumps much more difficult.

Bernardette Kunert, scientific director at imec, commented, “Over the past years, imec has pioneered nano-ridge engineering, a technique that builds on SAG and ART to grow low-defectivity III-V ...