Chinese silicon carbide (SiC) substrate manufacturers are facing mounting pressures as quality issues and a looming US trade ...

Centimetre-sized flexible diamond films have been produced by researchers in China, who grew them and then exfoliated them ...

Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

Electronics designers are moving away from conventional Si-based power electronics and towards wide-bandgap solutions.

Rad-hard devices are expensive to produce due to the raw materials used and special shielded packaging on the electronic ...

Imec, the research and innovation hub, has announced a significant milestone in silicon photonics. The organisation has been ...

Researchers in China have investigated the impact of phosphorus diffusion gettering on industrial silicon heterojunction ...

Infineon Technologies say sit has developed the first single chip CMUT capacitive MEMS ultrasonic transducer for switches and medical designs ...

Imec, a research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically driven ...

A flyback with a GaN switch offers higher efficiency across all metrics versus silicon—and it’s simpler to design. Enter the ...

Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor ...