The Fraunhofer Institute for Reliability and Microintegration IZM announces its active contribution to the APECS pilot line launched as part of the EU Chips Acts. APECS intends to promote the ...

Infineon Technologies say sit has developed the first single chip CMUT capacitive MEMS ultrasonic transducer for switches and medical designs ...

Electrical measurements on these diodes revealed that increasing their temperature from ambient to 573K produces a fall in ...

Researchers in China have investigated the impact of phosphorus diffusion gettering on industrial silicon heterojunction ...

The next-generation UCIe physical layer IP, based on TSMC's N4 process, is expected to finalize its design later this year, ...

Chinese silicon carbide (SiC) substrate manufacturers are facing mounting pressures as quality issues and a looming US trade ...

Imec, a research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically driven ...

Rad-hard devices are expensive to produce due to the raw materials used and special shielded packaging on the electronic ...

Bernardette Kunert, scientific director at imec, commented, “Over the past years, imec has pioneered nano-ridge engineering, a technique that builds on SAG and ART to grow low-defectivity III-V ...

Marvell Technology has announced the advancement of its custom XPU architecture with co-packaged optics (CPO) technology.

A flyback with a GaN switch offers higher efficiency across all metrics versus silicon—and it’s simpler to design. Enter the ...