January 15, 2025 -- ( BUSINESS WIRE )--Keysight Technologies, Inc. (NYSE: KEYS): ...

Apple has been voted onto the board of the UALink Consortium which is developing a standard for the interconnect for AI chips ...

Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

An AI boom is here and ASX semi stocks – including those focused on graphene, neuromorphic chips and quantum tech – are set ...

Parasitic extraction (PEX) in electronic design automation (EDA) calculates parasitic effects — such as capacitances, ...

The interconnects features and benefits include blind mating and a push-on interface for easy mating. The devices are durable and reliable. Typical applications areas for these BMB RF interconnects ...

Fig. 1: The industry roadmap for the transition of substrates from organic (top) to glass (bottom) and the path to 1µm L/S.

Niobium phosphide films outperform traditional metals, offering a breakthrough in conductivity for nanoscale electronics and ...

Onto Innovation secures orders for 3Di technology on Dragonfly G3. The launch of Iris G2 expands the metrology suite for the ...

Swathi Suddala’s innovative platform is a testament to how modern technology can revolutionize traditional healthcare ...

Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing ...