Chief executive of Advantest says major increase of B100/B200 complexity over H100/H200 dramatically increases testing times.

At 64 Gbps, the Gen3 IP delivers over 20 Tbps/mm in bandwidth density with ultra-low power and latency. The configurable ...

Following trend towards miniaturization, IC manufacturers are under constant pressure to increase the density of ...

Using Chiral Liquid Crystal Elastomer (CLCE), a mechanochromic material that changes color when stretched, researchers ...

Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a ...

A research team at POSTECH has developed a breakthrough technology that analyzes in real-time the deformation of "serpentine" ...

This ebook from our friends over at Rescale, focuses on why the historical methodology for determining cost, price per core hour is at best incapable of providing effective cost optimization for HPC ...

Alphawave Semi introduces the industry’s first 64 Gbps Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP ...

AMD's new Ryzen 7 9800X3D processor features thick layers of non-functional silicon on the CCD with SRAM extending on the ...

Nvidia, AMD and TSMC have invested millions in a startup that may hold the key to faster chip connectivity to quench AI's ...

Summary Scaling quantum computing needs fast interconnects, and Lightsynq proposes diamonds as a solution. CEO Mihir Bhaskar explains that bottlenecks in quantum networking, caused by slow optical ...

The EUV lithography market is expected to reach USD 22.69 billion by 2029 from USD 12.18 billion in 2024, at a CAGR of 13.2% ...