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钨铜合金 - 百度百科
钨铜是利用 高纯钨 粉优异的金属特性和高纯 紫铜 粉的可塑性、高 导电性 等优点,经静压成型、高温烧结、溶渗铜的工艺精制而成的复合材料。断弧性能好,导电导热好, 热膨胀 小,高温不软化,高强度,高密度,高硬度。 钨铜 电子封装 材料：既有钨的低膨胀特性,又具有铜的高导热特性,其 热膨胀系数 和导电 导热性 可以通过调整材料的成分而加以改变,从而给材料的使用提供了便利。 钨铜合金管 在硬质合金和难溶金属中有广泛运用。 因钨铜合金易于机械加工，所以在表面需要易于切削 …
W–Cu composites with submicron- and nanostructures: progress …
2019年12月20日 · The recently developed submicron- and nanostructured W–Cu composites exhibit superior performance compared to their conventional coarse-grained counterparts and are expected to further expand ...
钨铜 - 百度百科
钨铜材料可用作 破甲 材料，即一种所谓“药型罩”材料。 用钨铜材料 (常用W-30Cu材料)制成杯形或漏斗形的罩，倒装于弹药简的前端，靠火药的温度和压力使罩变形成射流而穿甲。 这种药型罩最早用 紫铜 制造，并大量应用。
The immiscible W/Cu composites with heterostructures and …
The W/Cu interface displayed a chaotic structure comprising intermingled W and Cu atoms, which suggested a significant diffusion process and the formation of a diffusion layer of a certain thickness. Upon reaching the melting point of W, the lattices of W and Cu were destroyed, resulting in the entire system entering a disordered state.
电子封装材料用钨铜合金 - 知乎 - 知乎专栏
钨铜合金（W-Cu合金）是一种兼有无机金属钨与铜优点的合金。 具体来说，其既有金属钨的高熔点、大密度和低膨胀系数的特点，又有金属铜的良好导电导热特性，所以常作为微电子封装材料。
Recent Advances in W–Cu Composites: A Review on the …
2023年11月8日 · Tungsten–copper (W–Cu) composite is a pseudoalloy prepared by powder metallurgy method with tungsten and copper as the main components, which are widely used in electrical contacts, electrical discharge machining electrodes, electronic packaging, aerospace, and military fields due to its good conductivity, thermal conductivity, high melting ...
Strengthening mechanisms and research progress in the W/Cu …
2024年12月1日 · Tungsten‑copper (W Cu) composites integrate the high melting point, strength, and superior wear and arc resistance of tungsten with the exceptional electrical and thermal conductivity and good plasticity of copper. This combination makes them ideal for applications requiring high thermal conductivity and resistance to high temperatures.
W–Cu composites with excellent comprehensive properties
2022年3月15日 · Improved Cu connectivity and uniformly dispersed ultrafine W particles are achieved in the UFG W–Cu composites. The prepared UFG W–Cu composites exhibit enhanced combination of hardness, compressive strength and electrical conductivity. Dislocations strengthening contributes the most to the strength improvement of the …
W-Cu复合材料的最新进展：制备、应用、性能 ... - X-MOL
钨铜（W-Cu）复合材料是一种以钨、铜为主要成分，采用粉末冶金方法制备的伪合金，由于其优异的性能，广泛应用于电接触、放电加工电极、电子封装、航空航天、军事等领域。