Filling the Gap: Underfill Materials Dispensing for Electronics
2024年12月3日 · The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, ball grid arrays (BGA), or chip-scale packages (CSP), and the substrate, such as a PCB or flex circuit.
What’s Your 2025 PCB Buying Strategy?
2024年12月3日 · The industry will face old and new challenges in the new year. This year’s supply chain issues and looming economic uncertainty have many PCB buyers wondering about 2025.
Circuits Assembly Online Magazine - Würth Elektronik Opens …
2024年12月5日 · MUNICH, GERMANY – Wurth Electronics Midcom Inc., German Branch, with EU headquarters in Munich, has opened a laboratory for the production of transformer prototypes at the Hightech Innovation Center in Munich-Freiham.
SIA Commends Finalization of CHIPS Incentives for Absolics and …
2024年12月5日 · The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce for Absolics—an affiliate of the Korea-based SKC—and Entegris.
Low-Temperature Solder: Challenges, Opportunities and …
2024年3月1日 · Low-temperature soldering (LTS) is a rapidly developing field with several potential benefits to the electronics industry. These benefits include reduced warping of components and substrates, lower energy consumption and reduced material costs. The lack of a standard solder alloy and the unique properties of emerging alloys, however, require development of new fluxes and processes for success.
VSI Announces Philippines Expansion - Circuits Assembly
2024年9月3日 · Circuits Assembly Magazine online Magazine. KUALA LUMPUR – VS Industry has leased 52,700 sq. m. of space in the ALogis Santo Tomas industrial park in Batangas, Philippines, to build a new manufacturing facility in the country.
Circuits Assembly Online Magazine - Unigen Launches DDR5 …
2024年12月5日 · Unigen's DDR5 family of high-performance memory modules are intended to meet the growing demand for bandwidth, capacity and power efficiency in compute, storage, networking, AI and industrial applications.
High-Density Interconnect Technology: An Overview - Circuits …
2024年2月1日 · Design and manufacturing considerations for HDI PCBs. High-density interconnect (HDI) technology has been a major enabler of advancement in the electronics industry, providing the dense interconnections and intricate circuitry needed to create state-of-the-art electronic devices that are tightly packed with miniaturized components and 2.5-D/3-D semiconductor packages.
System-in-Package and Multichip Module Technology
2024年6月27日 · Circuits Assembly Magazine online Magazine. Moving forward on the ‘More than Moore’ roadmap. We’re witnessing a rapid evolution in advanced semiconductor nodes and market growth due to the meteoric rise of AI, mobile, autonomous automotive, IoT, communications and cloud, health tech, and wearables.
2024 Service Excellence Awards - Circuits Assembly
Welcome to the 32nd annual Service Excellence Awards! Sponsored by CIRCUITS ASSEMBLY, the Service Excellence Awards (SEAs) for electronics manufacturing services (EMS) providers and electronics assembly equipment, material, service, and software suppliers and honor companies excelling in the crucial area of customer service.